BGA-Reballingschablone für Intel I3-2310M Prozessoren

BGA-Reballingschablone Typ: SR04SCPU Material: Edelstahl Abmessung: 90x90 Durchmesser SolderBalls ø: 0.35 mm Option: BGA Rahmen Artikel 610130 BGA Rahmen Artikel 610131 BGA-Balls Artikel 610143 Chip-Typen i3-2310M SR04S, i3-2350M SR0DQ, i3-2365M SR0U3, i3-2370M SR0DR, i3-2375M SR0U4 i7-2377M SR0CW, i3-3110M QC4U, i3-3110M QC4V, i3-3110M SR0N1, i3-3110M SR0N2 i3-3110M SR0T4, i3-3217U SR0N9, i3-3310M SR0N i5-2415M SR7, i5-2435M SR06Y, i5-2450M SR06Z, i5-2467 SR0D6, i5-2525M SR04A i5-2540M SR046, i5-2537M SR03W, i5-2557M SR0CS, i5-3210M SR0N0, i5-3317U SR0N8 i5-3337U SR0XL, i5-3427U SR0N7 i7-2617M SR03T, i7-2637M SR0D3, i7-2677M SR0D2, i7-3517U SR0N6, i7-3667U SR0N5 Pentium Dual-Core Mobile SR0V5, Pentium Dual-Core Mobile 987 SR0V4 Pentium Dual-Core Mobile 967 SR0FC, Pentium Dual-Core Mobile SR0FB Celeron Dual-Core SR08N