BGA-Reballingschablone für Intel I3-2310M Prozessoren

BGA-Reballingschablone
Typ: SR04SCPU
Material: Edelstahl
Abmessung: 90x90
Durchmesser SolderBalls ø: 0.35 mm
Option: BGA Rahmen Artikel 610130
BGA Rahmen Artikel 610131
BGA-Balls Artikel 610143
Chip-Typen
i3-2310M SR04S, i3-2350M SR0DQ, i3-2365M SR0U3, i3-2370M SR0DR, i3-2375M SR0U4
i7-2377M SR0CW, i3-3110M QC4U, i3-3110M QC4V, i3-3110M SR0N1, i3-3110M SR0N2
i3-3110M SR0T4, i3-3217U SR0N9, i3-3310M SR0N
i5-2415M SR7, i5-2435M SR06Y, i5-2450M SR06Z, i5-2467 SR0D6, i5-2525M SR04A
i5-2540M SR046, i5-2537M SR03W, i5-2557M SR0CS, i5-3210M SR0N0, i5-3317U SR0N8
i5-3337U SR0XL, i5-3427U SR0N7
i7-2617M SR03T, i7-2637M SR0D3, i7-2677M SR0D2, i7-3517U SR0N6, i7-3667U SR0N5
Pentium Dual-Core Mobile SR0V5, Pentium Dual-Core Mobile 987 SR0V4
Pentium Dual-Core Mobile 967 SR0FC, Pentium Dual-Core Mobile SR0FB
Celeron Dual-Core SR08N